Freeze Point | -10ºC |
pH | 8.0-10.5 |
Reserve alkalinity | >6.0 |
Thermal conductivity | 0.485 |
Specific heat at 50°C (kJ/kg-K) | 3.94 |
Viscosity (20°C (mPa sec)) | 2.8 |
Electrical conductivity | >2,000 |
Datacom Equipment Cooling System Loops
Direct-to-Chip Liquid Cooling
Data Center Cooling
Specially formulated inhibitor package designed to maintain superior corrosion protection and offer efficient heat removal
Made with DOW PuraGuard™ Propylene Glycol USP/EP, a pharmaceutical grade of monopropylene glycol with specified purity >99.8%
Provides freeze protection to -10°C (14°F)
Dyed Fluorescent Yellow for Leak Detection
DOWFROST™ LC 25 HEAT TRANSFER FLUID
As data centers evolve to handle the increasing demands of AI, machine learning, and high-performance computing, traditional air-cooling methods are proving insufficient and costly. The intense heat generated by modern processors can throttle performance and lead to premature hardware failure. The solution is a move to more efficient and reliable liquid cooling, and at the forefront of this technology is DOWFROST™ LC 25, a purpose-built heat transfer fluid for the next generation of data centers.
Direct liquid-to-chip cooling offers a significant leap forward in thermal management for high-density computing environments. By circulating a coolant directly over the hottest components, this method provides superior heat dissipation compared to air. This targeted approach not only enhances performance and reliability but also offers substantial operational benefits:
– Increased Rack Density: Efficiently cool more powerful processors in a smaller footprint.
– Reduced Energy Consumption: Lower your Power Usage Effectiveness (PUE) and operational expenditure by moving away from energy-intensive air conditioning.
– Enhanced Performance: Allow your processors to operate at their peak potential without the risk of thermal throttling.
– Quieter Operation: Eliminate the noise pollution associated with large-scale fan cooling.
Why DOWFROST™ LC 25 is the Superior Choice for Your Data Center
While the benefits of liquid cooling are clear, the choice of heat transfer fluid is critical to ensuring the longevity and reliability of your infrastructure. DOWFROST™ LC 25 is specifically engineered to meet the unique demands of modern data center and direct-to-chip cooling applications, offering a range of advantages over deionized water and other generic glycols.
Unmatched Corrosion Protection
Data center cooling loops often contain a variety of metals, including high-surface-area copper in cold plates. DOWFROST™ LC 25 features a specially formulated inhibitor package that provides robust protection against corrosion for a wide range of materials. This ensures the integrity and longevity of your cooling system, preventing costly downtime and equipment replacement.
Long-Term Stability and Reliability
Unlike deionized water, which can become corrosive over time and is susceptible to biological growth, DOWFROST™ LC 25 is designed for long-term stability. Its formulation resists degradation and fouling, ensuring consistent and reliable thermal performance throughout the life of your equipment.
Manufactured in USA

Australia & Oceania Delivery
DOWFROST™ LC 25
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Freeze Point | -10ºC |
pH | 8.0-10.5 |
Reserve alkalinity | >6.0 |
Thermal conductivity | 0.485 |
Specific heat at 50°C (kJ/kg-K) | 3.94 |
Viscosity (20°C (mPa sec)) | 2.8 |
Electrical conductivity | >2,000 |
Datacom Equipment Cooling System Loops
Direct-to-Chip Liquid Cooling
Data Center Cooling
Specially formulated inhibitor package designed to maintain superior corrosion protection and offer efficient heat removal
Made with DOW PuraGuard™ Propylene Glycol USP/EP, a pharmaceutical grade of monopropylene glycol with specified purity >99.8%
Provides freeze protection to -10°C (14°F)
Dyed Fluorescent Yellow for Leak Detection